生产技术能力

• 焊接贴装

• SMT (BGA, uBGA, PoP and 01005)

• BGA/CSP/CBGA/CCGA/PGA down to 140 micron pitch 可做到130微米的间距

• COB, PoP, Multichip, Chip on FPC

• Soldering & Flip Chip with die size of 0.3~55mm 焊接/倒装芯片的芯片尺寸在0.5~55mm